Upcoming Hardware Launches 2020 (Updated Jun 2020)


In this article, which our team will regularly update, we will maintain a growing list of information pertaining to upcoming hardware releases based on leaks and official announcements as we spot them. There will obviously be a ton of rumors on unreleased hardware, and it is our goal to—based on our years of industry experience—exclude the crazy ones. In addition to these upcoming hardware release news, we will regularly adjust the structure of this article to better organize information. Each time an important change is made to this article, it will re-appear on our front page with a “new” banner, and the additions will be documented in the forum comments thread. This article will not leak information we signed an NDA for.

Feel free to share your opinions and tips in the forum comments thread and subscribe to the same thread for updates.

Last Update (Jun 9th):

Older Updates

  • Apr 27th: Added AMD Renoir for Desktop, Added AMD Ryzen 3 3100 & Ryzen 3 3300X, Added AMD Zen 3 Cézanne APU, Updated AMD Zen 3, Updated Intel Comet Lake, Updated Intel Alder Lake, Updated AMD Arcturus, Added NVIDIA GeForce MX450, Updated Intel 400 Series Chipsets, Added AMD 600-Series Zen 3 Chipsets, Updated Hynix 128-layer Flash, Added Samsung 160-layer Flash, Updated TSMC 3-nanometer Process, Added TSMC 2-nanometer Process, Added Samsung 3-nanometer Process
  • Apr 6th: Updated Intel Comet Lake, Updated Intel Lakefield, Updated Intel Rocket Lake, Added RTX 2060 Super Mobile, Updated AMD RDNA2 Graphics Architecture, Added Intel 500-Series Chipsets, Updated DDR5 System Memory, Updated TSMC 5 nm process, Removed launched Athlon 3000 Mobile & Ryzen 4000 APUs / Renoir
  • Mar 12th: Updated AMD Zen 3 and Zen 4, Updated Intel Comet Lake, Added Intel Alder Lake, Updated VIA CenTaur, Updated AMD RDNA2, Added AMD RDNA3, Added AMD CDNA & CDNA2, Updated NVIDIA Ampere, Updated Intel Xe Graphics, Updated B550 Chipset, Updated DDR5 Memory, Updated PCI-Express 6.0, Removed launched Threadripper 3990X
  • Feb 12th: Updated Intel Comet Lake, Updated Intel Lakefield, Updated Intel Tiger Lake, Updated AMD Renoir APU, Updated VIA Centaur / Zhaoxin KaiXian, Separated AMD Arcturus and AMD RDNA2 into two separate sections, since Arcturus is based on Vega, Updated NVIDIA Ampere, Updated AMD Big Navi, Updated Intel Xe, Updated Intel 400-Series Chipsets, Updated DDR5 Memory, Updated Toshiba 128-Layer NAND Flash, Removed launched RX 5600 / RX 5600 XT
  • Jan 14th: Updated AMD Zen 3, Updated AMD Zen 4, Updated AMD Renoir Ryzen 4000 APU, Updated AMD Threadripper 3990X, Added AMD Athlon 3000 Mobile SOC, Added Intel Core i9-10990XE, Updated Intel Comet Lake, Updated Intel Tiger Lake, Updated VIA Centaur, Updated Intel Xe Discrete Graphics, Added NVIDIA Ampere, Added AMD Radeon RX 5600 / RX 5600 XT, Updated AMD Navi 12, Added AMD Big Navi, Updated AMD B550 / A520 Chipsets, Updated Hynix 4D NAND, Updated DDR5 System Memory, Updated TSMC 3 nanometer process, Removed launched products: RX 5500 / 5500 XT, new AMD Threadripper chipsets
  • Dec 2nd: Updated AMD Zen 3, Added AMD Threadripper 3990X, Updated AMD Renoir 3rd Gen APU, Updated Intel Tiger Lake, Updated Intel Comet Lake, Updated Intel Rocket Lake, Updated Intel Tremont, Updated Intel Cooper Lake, Added VIA CenTaur processor, Added NVIDIA RTX 2080 Ti Super, Added NVIDIA Hopper GPU architecture, Updated Intel Xe Graphics, Added Intel Ponte Vecchio GPU, Added Radeon RX 5300 XT, Updated Radeon RX 5500, Updated AMD Arcturus / RNDA2, Updated TSMC 5 nanometer, Added TSMC 3 nanometer, Removed launched products: Additional AMD Ryzen 3000 Zen 2 processors, Intel Cascade Lake, Cascade Lake-X, Threadripper 3rd Gen, Intel 9900KS, GTX 1660 Super, GTX 1650 Super
  • Oct 18th: Added Ryzen 7 3750X, Ryzen 9 3900 & Ryzen 5 3500X, Updated Threadripper 3rd Generation, Updated AMD Zen 3 & Zen 4, Updated Intel Core i9-9900KS, Updated Intel Ice Lake, Updated Intel Cascade Lake-X and marked as released, Updated Intel Tiger Lake, Updated Intel Sapphire Rapids, Added Intel Rocket Lake, Added Intel Meteor Lake, Updated Intel Xe, Added NVIDIA GTX 1660 Super, Updated NVIDIA GTX 1650 Ti, Added Radeon RX 5500 / Navi 14, Added AMD Radeon RX 5300 XT, Updated AMD Navi 12, Added AMD B550A Chipset, Updated AMD B550 Chipset, Updated Intel 400 Series Chipsets, Updated Updated AMD Threadripper 3rd Gen Chipsets, Added Micron 128-layer NAND Flash, Added TSMC N7+ EUV, Updated TSMC N6 & TSMC N5
  • Sep 4th: Updated Intel Comet Lake, Tiger Lake & Cooper Lake, Added AMD Ryzen 3500, Updated Threadripper 3rd Gen, Added AMD Renoir 3rd generation APU, Added Intel Tremont, Updated AMD Zen 3 & Zen 4, Added AMD Navi 12 / RX 5800, Added Threadripper 3rd Gen chipsets TRX40, TRX80, WRX80, Added Ryzen 3000 B550 & A520 chipsets, Updated HBM2e memory

    Added Toshiba 5-bit-per-cell NAND Flash (PLC), Updated Toshiba XLFlash, Added Hynix 128-layer NAND Flash, Added PCI-Express 6.0, Marked USB 4.0 as “released” and updated some info, Removed AMD Z490 and X499, which never materialized, Removed GeForce RTX 2070 Ti, which looks like it really was a typo, considering RTX 2070 Super has been released in the meantime. Removed GeForce RTX 2050, which seems to have been scrapped in favor of GTX 1660 / 1660 Ti. Removed older launched products: AMD Ryzen 50th Anniversary, AMD Ryzen 3000 Matisse & Picasso, Intel 28-core i9-9990XE, RX 5700 Navi, X570, PCIe Gen 4.0 SSDs, PCI-Express 4.0.
  • Jun 14th: Updated AMD Zen 2 / Ryzen 3000 and AMD Picasso APUs, Added Intel 9900KS, Intel Tiger Lake, Intel Sapphire Rapids, Intel Granite Lake, Updated Intel Ice Lake, Updated AMD Navi / Radeon RX 5700 Series and AMD Arcturus / RDNA 2, Added NVIDIA SUPER, Updated Intel Xe Graphics, Added AMD X570, Intel X499 / X299G, Intel 400 and Intel 495 Chipsets, Added TSMC 6 nanometer and Intel 7 nanometer processes, Updated PCI-Express 5.0, Added PCIe Gen 4.0 SSDs, Added USB 4.0, AMD Ryzen 50th Anniversary is launched now, Removed older launched products: GeForce GTX 1650, GTX 1660, Removed NVIDIA Volta and Ampere
  • Apr 29th: Added AMD Ryzen 50th Anniversary, Added AMD Ryzen 3000 APUs (Picasso), Added AMD Ryzen 3000 (Zen 2), Updated AMD Zen 3, Updated Intel Ice Lake, Updated Intel Comet Lake, Updated Intel Cascade Lake, which is released now, Added Intel Cascade Lake-X, Updated AMD Navi, Added GeForce GTX 1650 Ti, GeForce GTX 1650 and GTX 1660 have launched, Updated Intel Xe, Updated AMD X570 Chipset, Added HBM2e Memory, Added Intel CXL Interconnect, Added Toshiba 128-layer 3D NAND, Added TSMC 5 nanometer, Samsung 5 nanometer, Samsung 6 nanometer, Removed older launched products: Intel 9th gen Core KF, GeForce GTX 1660 Ti, Turing Mobile, Radeon VII, Vega 20
  • Feb 26th: Updated AMD Navi, Updated AMD Zen 2 / Ryzen 3000, Added AMD X570 chipset, Updated Intel discrete GPU, Updated Intel 28-core HEDT platform, Updated AMD Z490 chipset, Radeon VII and GTX 1660 Ti, RTX 20-Series Mobility, Intel 9th Gen Core KF are launched now, Removed older launched products: Ryzen 3000U APUs, GeForce GTX 1060 GDDR5X, GTX 2060, Intel B365 Express Chipset
  • Jan 17th: Removed “new Ryzen 2000 models”; these were launched as OEM-only, Added Ryzen 3000U Series APUs, Updated AMD Zen 2 / Ryzen 3000, Updated Intel Core “KF” SKUs, Added Intel “Lakefield” heterogenous processor, Added Intel Willow Cove and Golden Cove Cores, Added NVIDIA GeForce GTX 1660 Ti and TU116, RTX 2060 and GTX 1060 GDDR5X are now launched, Updated RTX 2060, Updated RTX 2050, Updated NVIDIA RTX Turing Mobile, Added AMD Radeon VII, Removed launched Polaris 30 / RX 590
  • Dec 19th: Updated Intel Ice Lake with information about “Sunny Cove” CPU cores and Gen11 iGPU, added Intel Willow Cove and Golden Cove CPU core early information, added Intel XE Discrete Graphics, added price and info for 28-core Intel Xeon W-3175X, added Intel 9th gen Core KF SKUs, added Ryzen 3 and Ryzen 5 3000U series mobile APUs, added first info about Ryzen 3000 from AMD Korea campaign, updated Zen 2 with client-segment Ryzen 3000-series probable launch dates, added Intel B365 Express chipset, updated NVIDIA RTX 2060;
  • Nov 29th: Added Intel Comet Lake, added NVIDIA GTX 1060 GDDR5X, added Intel Jupiter Sound, updated AMD Zen 2, updated Intel Arctic Sound, updated Intel Cascade Lake, updated DDR5 system memory, updated desktop Ryzen 2000 models: OEM only, Polaris 30 / RX 590 have been launched, removed launched QLC NAND flash, SSDs are in the market now from Samsung and Crucial
  • Nov 5th: Updated Zen 2, Added Zen 4, updated RTX 2070 Ti, updated Polaris 30 / RX 590, added Radeon MI-NEXT, updated PCIe 4.0, removed launched products: Ryzen Threadripper 2nd Generation, Intel Whiskey Lake, Skylake-X Refresh, GeForce 20 Turing, Intel Z390, GDDR6 graphics memory;
  • Oct 17th: Added Threadripper 2970WX and 2920 WX launch info, removed AMD B450, Whiskey Lake launched as “Coffee Lake Refresh”, removed Bay Trail Refresh, Updated Intel 28-core SKL-X XCC, updated Intel Ice Lake, updated AMD Zen 2, NVIDIA Turing / GeForce 20 is launched, added GeForce RTX 2070 Ti, added GeForce 2060 & 2050, added NVIDIA Turing Mobile, updated NVIDIA Volta, updated AMD Vega 20, added AMD Polaris 30, added AMD Arcturus, GDDR6 launched with GeForce 20, QLC now launched with the introduction of first SSDs, added AMD X499 Chipset, added Intel Intel Z399 Chipset, updated Intel Discrete GPU;
  • Aug 16th: Cleanup of launched products, added Intel Whiskey Lake, Cooper Lake, Cascade Lake, X599, updated Intel Cannon Lake, Ice Lake, 28-core HEDT platform, updated AMD Ryzen 2000 new models, AMD Zen 2, added NVIDIA GeForce GTX 20-series, updated NVIDIA Turing, updated Intel Discrete GPU, updated GDDR6, added SK Hynix 4D NAND, Toshiba XL-FLASH;
  • July 17th: Expanded AMD Ryzen Threadripper II series, added new Ryzen 2000 models, added Intel Bay Trail platform processor lineup expansion, added New Intel 28-core HEDT platform derived from LGA3467, updated Intel Z390, added AMD Vega 20, added GeForce 11-series, added info on Samsung LPDDR5 DRAM, expanded on GDDR6; cleanup of launched products: AMD Zen+, Intel i7-8086K and NVIDIA GTX 1050 3 GB, AMD 400 and Intel 300 chipsets;
  • May 24th: Updated AMD Zen 2, Zen+ second wave, Threadripper 2nd Gen, added GDDR6 info for NVIDIA, added AMD B450 chipset, added QLC NAND flash, added NVIDIA GTX 1050 3 GB, updated NVIDIA Turing, updated Intel Cannon Lake, updated Intel Z390, Updated DDR5;
  • April 26: Cleanup of launched products: Zen+, Intel Q1 Coffee Lake models and AMD 400 Series chipsets; added Intel Core i7-8086K, Cannon Lake and Ice Lake, added AMD Z490 chipset info, added Intel Z390 and X399 chipsets;
  • March 16: Added specific Zen+ release date and added more info on Ryzen 2600X; added first vendor names for new Coffee Lake motherboards. Intel confirmed fixes against Spectre/Meltdown for new Coffee Lake CPUs. More details on CFL Celeron/Pentium CPUs, AMD Dali APU, and NVIDIA Turing release date were added as well. Fixed PCIe 4.0 release date typo.


AMD Ryzen 3000 XT / Matisse Refresh [added]

  • Release Date: June 2020
  • Based on Zen 2 architecture
  • Uses 7 nm+ process by TSMC (N7P)
  • Ryzen 9 3900 XT: 12c/24t, 4.1 GHz Base, 4.8 GHz Boost, 70 MB cache, 105 W, € 499
  • Ryzen 7 3800 XT: 8c/16t, 4.2 GHz Base, 4.7 GHz Boost, 36 MB cache, 105 W, € 460
  • Ryzen 5 3600 XT: 6c/12t, 4.0 GHz Base, 4.7 GHz Boost, 32 MB cache, 95 W, € 320

AMD Renoir for Desktop [updated]

AMD Cézanne Zen 3 APUs

AMD Zen 3 [updated]

  • Release Date: September 2020
  • Design completed as of Aug 2019
  • Codename: Vermeer (CPU), Dali (APU w/ IGP), Milan (Server), Grey Hawk (Embedded), Genesis Peak (Threadripper)
  • Zen 3 refresh, possibly based on improved tech called “Warhol”
  • CCX removed, so that all cores on the CCD share a single large L3 cache
  • Continues to use Socket AM4 for desktop
  • Redesigned chiplets with 32+ MB shared L3 on each chiplet, as opposed to 2x 16 MB shared between CCX groups
  • Zen 3 processors are compatible with B450, X470, B550 and X570 motherboards (after BIOS flash)
  • Server platform codename “Genesis SP3”
  • Up to 64-cores (128-threads) across eight 8-core chiplets
  • 120 – 225 W TDP
  • Clock frequencies: 3.8 to 4.0 GHz base, 4.4 to 4.6 GHz boost
  • PCIe Gen 4
  • 8-channel DDR4 memory
  • New process tech: 7 nm Plus (probably not 7 nm+ EUV)
  • 20% increase in transistor density, 10% lower power consumption
  • Up to 15% IPC improvement + more from higher clock frequencies
  • Up to 50% faster floating point
  • Possibly support for AVX-512
  • New CPU core

AMD Zen 4

AMD Zen 5

Intel Ice Lake Server [added]

  • Release date: late 2020, or 2021
  • Ice Lake mobile was launched in Late 2019
  • Ice Lake desktop was scrapped because it wasn’t competitive with Comet Lake
  • Xeon codename “Whitley”
  • Uses new 4189-pin LGA socket
  • 8-channel DDR4 interface
  • 10 nanometer DUV (deep-ultraviolet) process
  • Brand-new CPU core design codenamed “Sunny Cove”
  • PCI-Express Gen 4.0
  • “GenuineIntel Family 6 Model 106 Stepping 4” processor: 24c/48t, 2.2 GHz base, 2.9 GHz boost, L1D 48 KB, L1I 32 KB, L2 1.25 MB, L3 36 MB
  • Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI
  • 20-30 broadening of various number crunching resources, wider execution window, more AGUs
  • SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. “Skylake”
  • Supports unganged memory mode
  • Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance
  • Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support
  • Gen11 also features tile-based rendering, one of NVIDIA’s secret-sauce features
  • Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this

Intel Ice Lake

  • Release Date: Late 2019 (mobile), desktop/server 2020
  • Ice Lake for desktop might be delayed even further (or scrapped completely) due to issues with the 10 nm process
  • Uses 10 nanometer DUV (deep-ultraviolet) process
  • Will use “Intel 10th gen” branding, with Core i3, i5 and i7
  • First processors are mobile quad-core designs
  • Ultra-low-power (ULP) platform was displayed at Computex: Using a multi-chip-module design, with TDP between 8 and 15 W
  • Mass production started in Q3 2019
  • Uses a brand-new CPU core design codenamed “Sunny Cove”
  • Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI
  • 20-30 broadening of various number crunching resources, wider execution window, more AGUs
  • SHA-NI and Vector-AES instruction sets, up to 75% higher encryption performance vs. “Skylake”
  • Supports unganged memory mode
  • First implementation will not be for a desktop processor, but a low-power SOC for notebooks (Ice Lake-U)
  • Ice Lake-U is 4-core/8-thread based on Sunny Cove w/ Gen 11 GT2 graphics with 64 EUs.
  • Ice Lake SP are Xeons “Whitley”, which will launch in 2020.
  • Integrated GPU based on new Gen11 architecture, up to 1 TFLOP/s ALU compute performance
  • Integrated GPU supports DisplayPort 1.4a and DSC for 5K and 8K monitor support
  • Gen11 also features tile-based rendering, one of NVIDIA’s secret-sauce features
  • Integrated GPU supports VESA adaptive V-sync, all AMD FreeSync-capable monitors should work with this

Intel Core i9-10990XE

Intel Cannon Lake

  • Release Date: Additional processors delayed to 2019+, probably canceled
  • One mobile SKU launched in May: Core i3-8121U 2.2 GHz, no integrated graphics
  • Core M3 8114Y: 1.5 GHz base, 2.2 GHz boost, 4.5 W TDP, Intel UHD iGPU
  • 10 nanometer production process
  • DDR4L support
  • Intel is reportedly having difficulties ramping up 10 nm, which could lead to delays
  • Adds AVX512 instructions (so far available only on HEDT platform, since Skylake-X). New instructions: AVX512F, AVX512CD, AVX512DQ, AVX512BW, and AVX512VL. New commands: AVX512_IFMA and AVX512_VBMI

Intel Lakefield Heterogenous processor

  • Release Date: 2020
  • Previewed: Oct 3, 2019
  • Uses 10 nanometer production process
  • A rendition of ARM big.LITTLE, but with Intel x86 cores
  • One large performance core combined with four low-power cores, and power-gating added to the mix
  • Uses Foveros Technology, which stacks IP blocks in three dimensions, not in a 2D plane like all current chip designs
  • Die size 12 mm x 12 mm x 1 mm
  • Big core is Sunny Cove based, small cores are Tremont based
  • Integrated Gen11 iGPU
  • Fully integrated chipset and network interfaces
  • Package designed for PoP (package over package) setups with DRAM and NAND flash chips over Foveros packaging
  • Target devices include tablets and tablet+notebook convertibles
  • Project Athena is an industry-wide effort involving a dozen companies to develop the next step in powerful mobile computing, rivaling the Ultrabook development a decade ago
  • Intel i5-L16G7: 1.4 GHz base, 1.75 GHz turbo, LPDDR4X memory
  • Intel i5-L15G7: 5c/5t, 4 small Tremont cores + 1 big Sunny Cove core, 1.4 GHz base, 2.75 GHz turbo, 1 MB L2, 4 MB L3

Intel Tiger Lake [updated]

  • Release Date: H2 2020
  • Intel reconfirmed “mid-2020” in their April 2020 Investor Call.
  • Mobile chip, succeeds “Lakefield”
  • CPU cores based on Willow Cove
  • Will be used in “Ghost Canyon” and “Panther Canyon” NUC
  • 28 W TDP
  • Reorganized cache architecture
  • Produced on 10 nm+ process
  • Tiger Lake-Y: 4-core/8-thread, up to 5.0 GHz boost, 2.3 GHz base, 1.25 MB L2 cache per core, 12 MB L3 cache
  • Tiger Lake-U: 28 W TDP
  • Larger L1D (data) cache: 48 KB
  • L1I (instruction) cache: 32 KB
  • DDR4-3200 memory speed
  • Platform name “Corktown”
  • Adds support for LPDDR5 memory, up to 6.4 GT/s
  • PCI-Express Gen 4
  • Integrated GPU based on Intel Xe architecture (not Gen 11)
  • GPU performance comparable to 8 CU Radeon Vega iGPU
  • Cache size increased from 2 MB per-core to 3 MB per-core, so total 12 MB
  • “Double digit CPU performance increase”, “Massive AI performance enhancement”
  • AVX512 supported
  • Uses 10 nm+ process
  • “Next-gen I/O”, probably PCIe 4.0
  • Thunderbolt support
  • Core i7-1185G7 4.7 GHz Boost, 3DMark: 2922 CPU, 1296 GPU, overall 1414
  • Core i7-1165G7: 4c/8t, 15 W or 28 W, 2.8 GHz Base, 4.4 GHz Boost, 3DMark: 4750 CPU, 1150 GPU, overall 1297

Intel Tremont / Snow Ridge [updated]

Intel Cooper Lake [updated]

Intel Willow Cove and Golden Cove Cores

  • Release Date: 2020 and 2021
  • Succeeds “Sunny Cove”
  • Willow Cove improves on-die caches, adds more security features, and takes advantage of 10 nm+ process improvements to increase clock speeds versus Sunny Cove
  • Golden Cove will add significant single-thread (IPC) increases over Sunny Cove, add on-die matrix multiplication hardware, improved 5G network-stack HSP performance, and more security features than Willow Cove

Intel Alder Lake [updated]

Intel Sapphire Rapids [updated]

Intel Rocket Lake [updated]

Intel Elkhart Lake [added]

Intel Meteor Lake [updated]

Intel Jasper Lake [added]

Intel Granite Rapids

VIA CenTaur / Zhaoxin KaiXian

Graphics / GPUs

NVIDIA RTX 3080 / RTX 3080 Ti / RTX 3090 [added]

NVIDIA RTX 2060 Super Mobile

NVIDIA GeForce MX450 Mobile

NVIDIA Ampere [updated]

  • Release Date: H2 2020
  • Announced: May 2020
  • Successor to “Turing” architecture
  • GeForce RTX 3000 Series
  • Engineering Sample: 7936 CUDA cores, 124 CUs, at 1.1 GHz, 32 GB VRAM
  • Engineering Sample: 7552 CUDA cores, 118 CUs, at 1.2 GHz, 24 GB VRAM
  • Engineering Sample: 6912 CUDA cores, 108 CUs, at 1.01 GHz, 47 GB VRAM
  • GA100 GPU: 826 mm², 54 billion transistors, 6912 CUDA cores, 3456 FP64 cores, 432 tensor cores, 108 SM, 40 GB HBM2E 6144-bit
  • GA103 is used on GeForce RTX 3080, 60 SMs = 3840 CUDA cores, 320-bit memory, 10 or 20 GB GDDR6
  • GA103 is used on GeForce RTX 3080, 60 SMs = 3840 CUDA cores, 320-bit memory, 10 or 20 GB GDDR6
  • GA104 is used on GeForce RTX 3070, 40 SMs = 3072 CUDA cores, 256-bit memory, 8 or 16 GB GDDR6
  • Produced on 7 nm TSMC & Samsung process
  • Updated Tensor cores, with double-precision FP64
  • PCI-Express 4.0 supported
  • Half the power consumption
  • Twice the performance (possibly for raytracing workloads)
  • Tesla server cards are going into Indiana University Big Red 200 supercomputer


AMD Radeon RX 5300 XT [updated]

AMD Radeon RX 5600M and RX 5700M [added]

  • Release date: unknown
  • Based on Navi 10 silicon
  • 7 nanometer production process
  • RX 5700M: 2304 shaders, 144 TMUs, 64 ROPS, 8 GB GDDR6 memory, 256-bit, 1620-1720 MHz
  • RX 5600M: 2304 shaders, 144 TMUs, 64 ROPS, 6 GB GDDR6 memory, 192-bit, 1190-1265 MHz

Big Navi / Navi 20 / Navi 21 [updated]


  • Release Date: Unknown
  • Successor to Vega 20
  • This could be the Arcturus-based Radeon Instinct MI100

AMD Arcturus

AMD RDNA 2 [updated]



Intel Xe Discrete Graphics [updated]

  • Release Date: mid-2020
  • Announcement: Xe DG1-SDV (Software Development Vehicle) announced at CES 2020 (Jan 9th 2020)
  • First Intel Discrete GPU since ill-fated Larrabee
  • New architecture built from the ground up, and not an upscale of Gen 11
  • Developer kit shipping as of Q4 2019, called “Discrete Graphics DG1 External FRD1 Accessory Kit (Alpha) Developer Kit”
  • SDV OpenCL performance in Geekbench: 55373 points, with 3.53 Gpixels/s in “Sorbel,” 1.30 Gpixels/sec in Histogram Equalization, 16 GFLOPs in SFFT, 1.62 GPixels/s in Gaussian Blur, 4.51 Msubwindows/s in Face Detection, 2.88 Gpixels/s in RAW, 327.4 Mpixels/s in DoF, and 13656 FPS in Particle Physics. Roughly matches 11 CU Vega Picasso IGP
  • SDV is 15.2 cm long, 96 Execution Units, PCI-Express x16, slot only power (so 75 W), 3x DisplayPort, 1x HDMI, high noise levels
  • Up to 2x performance uplift for Intel Xe integrated graphics over previous Gen 11
  • Using a multi-chip design approach, with Foveros, Intel Xe scales up to 512 EUs with 500 W
  • 512 EU model is datacenter only, 300 W 256 EU model for enthusiast markets
  • Targeted at 1080p gameplay, CES demonstration showed working gameplay on Destiny 2
  • Could be produced at Samsung to leverage their 10 nm tech, while Intel ramps up its own
  • Future Xe GPUs could be built on TSMC 6 nm and 3 nm nodes
  • Raytracing hardware acceleration support will definitely be included on the data-center GPUs (and probably on the consumer models, too)
  • Double-digit TFLOP/s scaling all the way up to 0.1+ PFLOP/s
  • Will be used in upcoming Cray Aurora Supercomputer for Argonne National Laboratory in 2021
  • Targeting a wide segment of markets, including consumer (client-segment) graphics, enthusiast-segment, and data-center compute
  • Uses new graphics control panel that’s being introduced during 2019

Intel Discrete GPU / Arctic Sound

Intel Ponte Vecchio

Intel Jupiter Sound


Intel X399

Intel X499 / X299G

Intel X599

Intel Z399

Intel 500 Series Chipsets

Intel 495 Series Chipsets

AMD B550 & A520 Chipsets [updated]

AMD B550A Chipset

AMD 600-Series Chipsets


DDR5 System Memory

  • Release Date: 2020 or 2021
  • JEDEC standard not fully complete yet, as of Q1 2020, expected for later in 2020
  • Demo’d in May 2018 by Micron: DDR5-4400
  • Samsung 16 Gb DDR5 DRAM developed since February 2018
  • Samsung has completed functional testing and validation of a LPDDR5 prototype: 10 nm class, 8 Gbit, final clocks: DDR5-5500 and DDR5-6400
  • SK Hynix has 16 Gb DDR5-5200 samples ready, 1.1 V, mass production expected 2020
  • April 2020: Hynix has 8.4 Gbps DDR5, minimum density per die is 8 Gbit, maximum is 64 Gbit
  • ECC is now supported by all dies (no longer specific to server memory modules)
  • SK Hynix demonstrated DDR5 RDIMM modules at CES 2020: 4800 MHz, 64 GB
  • Micron is shipping LPDDR5 for use in Xiaomi phones (Feb 2 2020). 5.5 Gbps and 6.4 Gbps
  • Samsung has begun production for LPDDR5 for mobile devices (Feb 25 2020). 16 GB, 5.5 Gbps
  • 4800 – 6400 Mbps
  • Expected to be produced using 7 nm technologies
  • 32 banks, 8 bank groups
  • 64-bit link at 1.1 V
  • Voltage regulators on the DIMM modules
  • AMD DDR5 memory support by 2021/2022, with Zen 4

HBM2E Graphics Memory

HBM3 Graphics Memory

GDDR6X Graphics Memory [added]

Silicon Fabrication Tech

TSMC 7 nanometer+

TSMC 6 nanometer

TSMC 5 nanometer

TSMC 5 nanometer+ [added]

TSMC 3 nanometer

TSMC 2 nanometer [updated]

Samsung 6 nanometer

Samsung 5 nanometer [updated]

Samsung 3 nanometer

Intel 7 nanometer


Hynix 4D NAND

Toshiba 5-Bit-per-Cell NAND Flash (PLC)

Toshiba XL-Flash

Micron 128-layer 3D NAND Flash

Toshiba 128-layer 3D NAND Flash

Intel 144-layer 3D NAND Flash [added]

SK Hynix 128-layer 3D NAND Flash

Samsung 160-layer 3D NAND Flash

Intel CXL Interconnect

PCI-Express 5.0

PCI-Express 6.0

USB 4.0